北京清华大学高精尖研究中心
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说明: The brain-like computing is a representative of multidisciplinary integration that focuses on solving the following scientific and technical issues:1) The basic theory of brain-like computing: solve the theoretical problems in brain-like computing system about “how to express, how to deal with, and how to use information”;2) brain-like computing chip: mainly studies the question of “how to load, what to load, how to use” information on physical carriers in chips;3) brain-like computing software: solve the problem of “how to allocate, how to interact, how to dispatch” information flow in brain-like computing software;4) Application platform: build two brain-like computing application platforms mainly for big data and intelligent robot, and develops artificial general intelligent (AGI) techn...
说明: Regarding the study of future memory, it focuses on new materials, new architectures, chips, and storage systems of future memories based on resistive and magnetic changes.Regarding the core challenges in future storage technologies, it chiefly addresses the following scientific and technical issues: 1) Inherent physical relationship between storage material system and storage device performance, and setting up appropriate models and predict the performance of storage devices;2) Future memory chips: mainly study how to develop memory chips with ultra-high density and ultra-low power consumption;3) Future storage computing fusion chip: solve the problem of computing and storage fusion, disrupt the von Neumann architecture, and achieve low power consumption supercomputing;4) Future storage s...
案例名称: Flexible chip
说明: Oriented to health applications for wearable devices, it aims to achieve breakthroughs in key design theories and integration techniques for flexible circuit systems that integrate oxide semiconductor and silicon integrated circuits, including system architecture solutions, device/circuit layer hybrid design methods, device models, and integration methods, and systematic design methodology and other key scientific issues.Expected major achievements include:1) construct a generic flexible sensing platform prototype for human health applications;2) develop 1-2 demonstration applications;3) Publish papers on world-class SCI journals such as Nature, Scienceand at the international conferences such as IEDM and ISSCC.
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Address: Beijing Innovation Center for Future Chip, Building A, 3# Heqing Road, Haidian District, Beijing, China
Telephone: 010-62788711
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