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The Second Session of Future Chip Forum Held in Tsinghua University

Date: 2017-12-28
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The Second Session of Future Chip Forum Held in Tsinghua University 


The 2nd Future Chip Forum was held in the main hall of Tsinghua University from 12 December to 20 December. Over 80 world-renowned scholars and researchers specialized in integrated circuit and smart chip architecture, computing, and application, and over 20 IEEE fellows joined the event in Tsinghua to discuss the future prospect of smart chips. Zheng You, the vice president of Tsinghua University and the director of Beijing Innovation Center for Future Chip (ICFC), head of the department of microelectronics and nanoelectronics, and the dean of the institute of microelectronics Shaojun Wei were jointly in charge of the forum committee. The event attracted over 400 scholars and students worldwide.


The Second Session of Future Chip Forum Held in Tsinghua University  

The venue of the 2nd Future Chip Forum

 

In partnership with the Institute of Microelectronics, ICFC co-hosted the 2nd future chip forum “Smart Chips, Smart World”this year.

 

Zheng You gave an opening speech on behalf of Tsinghua University and ICFC. In his speech, he stated that since the 19th CPC National Congress proposed “to facilitate a strong tie built between internet, big data, artificial intelligence, and manufacturing” and as the development of artificial intelligence has been elevated to the level of a national imperative in “The Plan for Developing a New Generation of Artificial Intelligence” published by the State Council, a prospective discussion on smart chips is of strategic significance


The Second Session of Future Chip Forum Held in Tsinghua University  

Zheng You gives a speech during the opening ceremony

 

Shaojun Wei, Computer Science professor at Tsinghua University and academician of Chinese Academy of Sciences, made two special reports respectively titled as “Artificial Intelligence and Future Chips” and “ Software Defines Chips- an Innovative Architecture for Smart Chips”. As the information society continuously moves towards a more intellectualized trajectory, smart chips have emerged as an indispensable carrier and a core technology for the smart society. Concurrently, both academia and industry are relentlessly pursuing a more progressive innovation in artificial intelligence architecture. Tsinghua University, in particular, have made sound impact in this specific field of research.


 The Second Session of Future Chip Forum Held in Tsinghua University

Bo Zhang introduces artificial intelligence and future chips to the audience

 

The Second Session of Future Chip Forum Held in Tsinghua University

Shaojun Wei reports on the innovative architecture of smart chips


Ming Liu, academician of Chinese Academy of Sciences, and the president of Synopsys Qun Ge successively made speeches. By means of reporting and group discussion, all special guests engaged in a world-class academic dialogue by exchanging opinions about six main topics, including “ Smart Chips and System in Academia and Industry”, “ Design, Automation Design, and Calculation Models in the the AI Era”, “Computing, Software, and Deep Learning Architecture”, “ Brain-like Chips and Neural Network Accelerator”, “The Smart Applications of Built-in Internet of Things ”, “Emerging Neural Form Calculation”.

 

The Second Session of Future Chip Forum Held in Tsinghua University

A group picture of special guests, scholars, and students

 

Over the course of the three-day forum, a wide range of ground-breaking innovations related to smart chips were presented at the main hall. For instance, Thinker chip developed by the department of Nanoelectronics of Tsinghua University, smart gaming presented by the department of electronics, AI composing and painting technologies brought by the department of computer science. In addition, leading tech firms such as DeePhi Tech, Horizon Robotics, and Face++. The academic posters shared by more than 23 PhD candidates from the department of precision instrument, microelectronics, physics and electronics also attracted much attention and caused sparks of discussion among the visitors.

 

The Second Session of Future Chip Forum Held in Tsinghua University

The display area

 

This year's forum received generous support and widespread attention from researchers in the field of integrated circuit, as well as industry actors. The president of IEEE SSCS, Prof. Jan Van der Spiegel from the University of Pennsylvania, the chairman of electronics committee at IEEE, Prof. Yong Lian from the Singapore State University, the chairman of electronic device committee at IEEE, Prof. Albert Wang from the University of California Riverside, the chairman of Automation Design Conference, Prof. Xiaobo Hu from University of Notre Dame, and senior management from Intel, ARM, and Sysnopsys attended the forum.

 

Future Chip Forum is hosted by Beijing Innovation Center for Future Chip. The annual event aims at establishing an interdisciplinary, transboundary communication platform connecting education institutions for integrated circuit, research institutions, and industry. The 1st Future Chip Forum, “Challenges and Opportunities for Design Automation”, has received tremendous attention worldwide.


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